Onto Innovation Inc. (NYSE: ONTO) today announced it will be exhibiting at SEMICON West on July 9-11, 2024. Onto Innovation invites customers to booth 633 to learn about the Company’s latest portfolio of integrated process and process control solutions being used to support its customers’ ramp of AI products. Onto will feature a selection of its latest technologies helping to enable advanced packaging, including lithography for next generation AI and chiplet designs employing cutting edge panel-level production technologies (CCL and glass handling) and unique 3D metrology and inspection capabilities in support of next generation bump technologies. In addition, Onto will feature metrology solutions for advanced node logic (CPU/GPU) and memory (HBM, DRAM and NAND) applications; and a range of technologies for the production of specialty devices, including those for GaN and SiC, powering the advanced automotive market and electric vehicles. Onto’s product experts will be at the booth to answer specific applications questions.
To schedule a customer meeting, please contact Onto at [email protected].
The Onto Innovation management team is looking forward to holding investor meetings during the SEMICON West show at the InterContinental San Francisco, 888 Howard Street.
To schedule an investor meeting, please contact Sidney Ho at [email protected].
In addition to the exhibit booth and meetings, please join Onto for two technical presentations in the program featuring Onto’s enterprise software. In the Smart Manufacturing Pavilion, Onto’s software expert Prasad Bachiraju will present Achieving Zero Defect Manufacturing in Semiconductor Fabs on Wednesday, July 10, at 11:00 a.m. PT in Moscone South at the Smart Manufacturing Pavilion Stage. On the TechTALKS stage, Onto’s Bryce Chi will present Using Deep Learning ADC for Defect Classification for Automatic Defect Inspection on Thursday, July 11, at 2:35 p.m. PT in Moscone South, Exhibition Level, Room 7.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.
Source: Onto Innovation Inc.
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