Samsung Electronics' chairman, Lee Jae-Yong, confirmed that the company has no plans to split its contract-based chip manufacturing and logical chip design units. This comes despite these businesses generating significant annual losses due to weak demand, impacting Samsung's overall performance as the world's leading memory chip maker.
In 2019, Lee shared a vision to surpass TSMC and become the top global contract-based chip manufacturer by 2030. When questioned about the possibility of separating the manufacturing and design divisions, Lee emphasized Samsung's focus on developing these sectors rather than splitting them.
Analysts estimate that Samsung's wafer foundry and system logic chip segments incurred operating losses of 3.18 trillion Korean won (approximately $2.4 billion) last year, with potential additional losses of 2.08 trillion won forecasted for this year.
