The U.S. Department of Commerce has approved a $458 million subsidy and a $500 million loan for SK Hynix to support its chip packaging plant and AI product R&D facilities in Indiana. This subsidy is slightly higher than the initial agreement in August. SK Hynix plans to invest $3.87 billion in a new plant in West Lafayette, U.S. This facility will include a production line for next-generation high-bandwidth memory chips, essential for training AI GPUs. The investment is expected to create 1,000 jobs and enhance the U.S. semiconductor supply chain. SK Hynix's CEO expressed optimism about building a resilient AI semiconductor supply chain in the U.S. The U.S. has also provided subsidies to other leading semiconductor manufacturers such as TSMC (TSM, Financial), Intel (INTC), and Micron (MU). Only Samsung Electronics is yet to finalize its $6.4 billion subsidy.
SK Hynix Secures $458 Million U.S. Grant to Bolster AI Chip Manufacturing
Dec 19, 2024
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