Techbond Group Bhd

XKLS:5289 (Malaysia)  
RM 0.53 (0%) Jul 2
18.93
P/B:
1.57
Market Cap:
RM 294.71M ($ 62.45M)
Enterprise V:
RM 279.65M ($ 59.26M)
Volume:
5.42M
Avg Vol (2M):
6.07M
Trade In:
Volume:
5.42M
Avg Vol (2M):
6.07M

Business Description

Description
Techbond Group Bhd is an investment holding company and is engaged in the provision of management services to its subsidiaries. Its subsidiaries are principally involved in developing and manufacturing industrial adhesives namely water-based adhesives and hot melt adhesives, sealants namely water-based and solvent-based sealants; and providing supporting products and services. A substantial part of the revenue is generated from Industrial adhesives and sealants segment. The company operates in various geographical locations namely, Malaysia, Vietnam, Indonesia, China and others with majority of the revenue being generated from its operations in Vietnam.

Financials

XKLS:5289's 30-Y Financials
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Historical Operating Revenue by Business Segment

Historical Operating Revenue by Geographic Region

5-Step DuPont Analysis as of
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Performance

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Techbond Group Bhd Executives

Details

Valuation Chart

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Analyst Estimate

Key Statistics

Name Value
Revenue (TTM) (Mil RM) 146.714
EPS (TTM) (RM) 0.028
Beta 0.57
Volatility % 34.9
14-Day RSI 65.17
14-Day ATR (RM) 0.028162
20-Day SMA (RM) 0.48225
12-1 Month Momentum % 13.33
52-Week Range (RM) 0.36 - 0.585
Shares Outstanding (Mil) 556.06

Piotroski F-Score Details

Year:
Component Result
Piotroski F-Score 8
Positive ROA
Positive CFROA
Higher ROA yoy
CFROA > ROA
Lower Leverage yoy
Higher Current Ratio yoy
Less Shares Outstanding yoy
Higher Gross Margin yoy
Higher Asset Turnover yoy

Techbond Group Bhd Filings

Filing Date Document Date Form
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Techbond Group Bhd Stock Events

Financials Calendars
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Techbond Group Bhd Frequently Asked Questions

What is Techbond Group Bhd(XKLS:5289)'s stock price today?
The current price of XKLS:5289 is RM0.53. The 52 week high of XKLS:5289 is RM0.59 and 52 week low is RM0.36.
When is next earnings date of Techbond Group Bhd(XKLS:5289)?
The next earnings date of Techbond Group Bhd(XKLS:5289) is .
Does Techbond Group Bhd(XKLS:5289) pay dividends? If so, how much?
The  Dividend Yield %  of Techbond Group Bhd(XKLS:5289) is 0.94% (As of Today), Highest Dividend Payout Ratio of Techbond Group Bhd(XKLS:5289) was 0.43. The lowest was 0.22. And the median was 0.28. The  Forward Dividend Yield % of Techbond Group Bhd(XKLS:5289) is 0.94%. For more information regarding to dividend, please check our Dividend Page.

Press Release

Subject Date
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